Ifloor Perfor-M

iFLOOR®PERFOR-M is a perforated underlay for underfloor heating and sound insulation, based on the HPE series, developed for applications requiring both effective impact noise insulation and high thermal conductivity.

The material is made of high-density, chemically cross-linked polyethylene with a special perforation structure that allows for optimal heat exchange without compromising acoustic properties. Thanks to this technology, iFLOOR PERFOR-M is particularly suitable for flooring systems with underfloor heating.

The perforation reduces the contact area and allows for better load distribution while maintaining the integrity of the cellular structure. This prevents material crushing and ensures long-term operational efficiency.

Application

iFLOOR PERFOR-M is used as a sound insulation layer under final floor coverings, especially in underfloor heating systems where a balance between acoustic insulation and thermal conductivity is required.

Suitable for:

• underfloor heating (water and electric)

• laminate and parquet

• SPC / LVT flooring

• residential and commercial buildings

• modern energy-efficient systems